Radiation-emitting semiconductor component and method for producing radiation-emitting semiconductor component

ABSTRACT

A radiation-emitting semiconductor device ( 1 ) is specified, comprising a semiconductor body ( 2 ) having an active region ( 20 ) provided for generating radiation, a carrier ( 3 ) on which the semiconductor body is arranged and an optical element ( 4 ), wherein the optical element is attached to the semiconductor body by a direct bonding connection. 
     Furthermore, a method for producing of radiation-emitting semiconductor devices is specified.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a national stage entry from InternationalApplication No. PCT/EP2018/075488, filed on Sep. 20, 2018, published asInternational Publication No. WO 2019/063412 on Apr. 4, 2019, and claimspriority under 35 U.S.C. § 119 from German Patent Application No.102017122325.8, filed on Sep. 26, 2017, the entire contents of all ofwhich are incorporated herein by reference.

The present application relates to a radiation-emitting semiconductordevice and a method for producing radiation-emitting semiconductordevices.

For beam shaping, optical elements are often placed onradiation-emitting semiconductor chips. However, an individual assemblyof such optical elements is expensive, time-consuming and complex, inparticular when a high positioning accuracy is required.

An object is to specify a semiconductor device, which is produced easilyand reliably and is characterized by good radiation properties.Furthermore, a method is to be specified with which semiconductordevices can be produced efficiently and with high accuracy.

These objects are solved by a radiation-emitting semiconductor device ora method according to the independent claims. Further developments andexpediencies are the subject-matter of the pending claims.

A radiation-emitting semiconductor device is specified.

According to at least one embodiment of the radiation-emittingsemiconductor device, the radiation-emitting semiconductor device has asemiconductor body having an active region provided for generatingradiation. For example, the active region is part of a semiconductorlayer sequence that is in particular epitaxially deposited. For example,the active region is arranged between a first semiconductor region and asecond semiconductor region, wherein the first semiconductor region andthe second semiconductor region are different from one another at leastin places with respect to the conductivity type, so that the activeregion is located in a pn-junction. The active region, for example, isintended to generate electromagnetic radiation in the ultraviolet,visible or infrared spectral range.

According to at least one embodiment of the radiation-emittingsemiconductor device, the radiation-emitting semiconductor device has acarrier on which the semiconductor body is arranged. The carrier servesin particular for the mechanical stabilization of the semiconductorbody. For example, the carrier is a growth substrate for the epitaxialdeposition of the semiconductor body or a carrier different from thegrowth substrate.

According to at least one embodiment of the radiation-emittingsemiconductor device, the radiation-emitting semiconductor device has anoptical element. The optical element is intended in particular to shape,for example to focus, collimate or expand the radiation emitted from theactive region according to a predetermined radiation characteristic, inparticular a spatial radiation characteristic. The optical element isformed to be transmissive, in particular for the radiation generated inthe active region.

According to at least one embodiment of the radiation-emittingsemiconductor device, the optical element is attached to thesemiconductor body with a direct bonding connection.

In the case of a direct bonding connection, the connecting partners tobe connected to one another, which are in particular prefabricated, areheld together by atomic and/or molecular forces, in particular by meansof hydrogen bonds and/or Van der Waals interactions. A direct bondingconnection is typically produced between two flat interfaces solelyunder the influence of pressure and/or temperature. A joining layer suchas an adhesive layer or a solder layer is not required for a directbonding connection. Absorption losses in such a joining layer can beavoided.

The interfaces, between which the direct bonding connection is formed,preferably have a root-mean-squared roughness (also known as rmsroughness) of at most 5 nm, in particular at most 3 nm or at most 1 nm.

The semiconductor body and the optical element need not necessarilydirectly adjoin one another. For example, one or two auxiliary bondinglayers can be arranged between the semiconductor body and the opticalelement. For example, an oxide layer, such as a layer containing silicondioxide, is suitable as auxiliary bonding layer. The auxiliary bondinglayer is expediently formed to be transmissive to the radiation to begenerated in the active region, for example with a transmission of atleast 90% or at least 95%. This applies analogously to any furtherauxiliary bonding layer that may be present.

In at least one embodiment of the radiation-emitting semiconductordevice, the radiation-emitting semiconductor device comprises asemiconductor body having an active region provided for generatingradiation, a carrier on which the semiconductor body is arranged, and anoptical element, wherein the optical element is attached to thesemiconductor body by a direct bonding connection.

During the production of the radiation-emitting semiconductor device,the direct bonding connection between the optical element and thesemiconductor body can still be produced in the composite simultaneouslyfor a plurality of semiconductor devices. At the same time, a directbonding connection is characterized by high reliability, in particularover a wide temperature range. The attachment in a composite can beachieved with a particularly high accuracy, in particular when comparedto the individual attachment of individual optical elements onindividual semiconductor bodies. For example, the optical element isattached to the associated semiconductor body with an accuracy of 1micrometre or less.

According to at least one embodiment of the radiation-emittingsemiconductor device, the carrier and the optical element terminateflush with a side surface delimiting the semiconductor device. Duringthe production of the radiation-emitting semiconductor device, thecarrier and the optical element can be severed in a common separationstep. The carrier and the optical element can therefore havecharacteristic traces of the separation process, for example traces ofmechanical material removal, such as saw marks, traces of chemicalmaterial removal, or traces of material removal by means of coherentradiation, such as a laser separation process.

Furthermore, the carrier, the optical element and the semiconductor bodypreferably terminate flush with a side surface delimiting thesemiconductor device. The semiconductor body is preferably arrangedbetween the carrier and the optical element. This is to say that theside surfaces of the semiconductor body preferably terminate flush withthe side surfaces of the carrier and the side surfaces of the opticalelement. Furthermore, the carrier, the optical element and thesemiconductor body can be severed in a common separation step during theproduction of the radiation-emitting semiconductor device. The carrier,the optical element and the semiconductor body can therefore havecharacteristic traces of the separation process, for example traces ofmechanical material removal, such as saw marks, traces of chemicalmaterial removal or traces of material removal by means of coherentradiation, such as a laser separation process.

According to at least one embodiment of the radiation-emittingsemiconductor device, a mirror region is arranged between the activeregion and the optical element. The mirror region, for example, isformed as a Bragg mirror. For example, the mirror region is a part of aresonator in which the active region is located. For example, theradiation-emitting semiconductor device is a vertical cavity surfaceemitting laser (VCSEL) or a resonant cavity light emitting diode(RCLED).

According to at least one embodiment of the radiation-emittingsemiconductor device, the mirror region is arranged between the activeregion and the direct bonding connection. During the production of theradiation-emitting semiconductor device, the mirror region is thuslocated on the same side of the direct bonding connection as the activeregion. For example, the mirror region is a part of the semiconductorbody or is arranged on the side of the semiconductor body facing theoptical element.

A mirror region arranged outside the semiconductor body is, for example,formed by a plurality of dielectric layers. In contrast to a Braggmirror integrated in the semiconductor body, individual layers of adielectric Bragg mirror can exhibit comparatively large differences inthe refractive index, so that a highly efficient Bragg mirror can beproduced in a simplified manner.

A Bragg mirror integrated into the semiconductor body can be inparticular formed electrically conductive, for example p-conductive orn-conductive. The electrical contacting of the active region can beproduced through the mirror region.

According to at least one embodiment of the radiation-emittingsemiconductor device, the mirror region is arranged between the directbonding connection and the optical element. During the production of theradiation-emitting semiconductor device, the mirror region can be formedon the optical element even before the direct bonding connection isproduced.

According to at least one embodiment of the radiation-emittingsemiconductor device, the active region is divided into a plurality ofsegments. In particular, the segments can be externally electricallycontrolled independently of one another. For example, the majority ofsegments are arranged laterally next to one another in a one-dimensionalor two-dimensional matrix. In particular, the optical element may extendcontinuously over the majority of segments. For example, the opticalelement has an optical segment for each segment, wherein the opticalsegments can be formed identically or differently with respect to theirbeam shaping.

For the external electrical contacting, the radiation-emittingsemiconductor device has at least two contacts. By applying an externalelectrical voltage between the contacts, charge carriers can enter theactive region from different sides and recombine there while emittingradiation.

According to at least one embodiment of the radiation-emittingsemiconductor device, a contact for external electrical contacting ofthe semiconductor device is arranged on a side of the semiconductor bodyfacing the optical element. The direct bonding connection adjoins anauxiliary bonding layer, in particular on a side facing thesemiconductor body. The auxiliary bonding layer completely covers thecontact and, for example, has a greater vertical extent in places thanthe contact. For example, during production of the radiation-emittingsemiconductor device, the auxiliary bonding layer serves to planarizethe surface facing the optical element.

A contact arranged on the side facing the optical element is formed, forexample, ring-like so that the radiation generated in the active regioncan exit through the opening of the ring.

According to at least one embodiment of the radiation-emittingsemiconductor device, the radiation-emitting semiconductor device hastwo contacts for external electrical contacting on a side of thesemiconductor body facing away from the optical element, for example ona side of the carrier facing away from the semiconductor body. Inparticular, the side of the semiconductor body facing the opticalelement can be completely free of electrical contacts. In this case, theoptical element can also completely cover the semiconductor body.

Furthermore, a method for producing radiation-emitting semiconductordevices is specified.

According to at least one embodiment of the method, a semiconductorlayer sequence is provided with an active region provided for generatingradiation on a carrier and with a first interface. The interface can beformed by the semiconductor layer sequence or by a layer arranged on thesemiconductor layer sequence, for example an auxiliary bonding layer.The semiconductor layer sequence can already be divided into a pluralityof semiconductor bodies. The active region of a semiconductor body canbe divided into a plurality of segments.

According to at least one embodiment of the method, the method comprisesa step in which an optics carrier with a second interface is provided.The second interface can be formed by the optics carrier or by a layerarranged on the optics carrier, for example a further auxiliary bondinglayer.

According to at least one embodiment of the method, the method comprisesa step in which a direct bonding connection is produced between thefirst interface and the second interface. This forms a composite withthe carrier with the semiconductor layer sequence on the one hand andthe optics carrier on the other.

According to at least one embodiment of the method, the method comprisesa step in which a separation into the plurality of radiation-emittingsemiconductor devices takes place, wherein the radiation-emittingsemiconductor devices each comprise a part of the carrier, a part of thesemiconductor layer sequence and a part of the optics carrier. Inparticular, the semiconductor layer sequence results in a semiconductorbody for each radiation-emitting semiconductor device and an opticalelement from the optics carrier in each case.

During the production of the direct bonding connection, the carrier andthe optics carrier can be positioned with a high accuracy with respectto one another, for example by using alignment marks which are arrangedon the carrier and/or the optics carrier, in particular in each case inan edge region thereof.

In at least one embodiment of the method, a semiconductor layer sequencewith an active region provided for generating radiation is provided on acarrier with a first interface. An optics carrier with a secondinterface is provided. A direct bonding connection is produced betweenthe first interface and the second interface. A separation into theplurality of radiation-emitting semiconductor devices is carried out,wherein the radiation-emitting semiconductor devices each comprising apart of the carrier, a part of the semiconductor layer sequence and apart of the optics carrier.

According to at least one embodiment of the method, the optics carrierand the carrier are severed during the separation, in particular in acommon separation step. In such semiconductor devices, the semiconductorbody and the associated optical element can terminate flush with a sidesurface of the semiconductor device at least in places.

According to at least one embodiment of the method, the first interfaceand/or the second interface are smoothed, in particularchemo-mechanically polished, before the direct bonding connection isproduced. Such a process, also known as CMP process, can produceparticularly smooth surfaces with high efficiency and accuracy.

According to at least one embodiment of the method, a contact isarranged on the semiconductor layer sequence, wherein the contact iscovered by the optics carrier during the production of the directbonding connection and is exposed after the production of the directbonding connection. The optics carrier can be completely removed inplaces in the vertical direction, i.e. perpendicular to a main plane ofextension of the active region.

According to at least one embodiment of the method, a contact and anauxiliary bonding layer, which covers the contact, are arranged on thesemiconductor layer sequence, wherein the auxiliary bonding layer ischemo-mechanically polished before the direct bonding connection isproduced. This simplifies the production of a flat first interface. Thebonding auxiliary layer can still completely cover the contact afterpolishing. The auxiliary bonding layer thus continuously forms aninterface for the direct bonding connection.

Alternatively, it is also conceivable that the contact is at leastpartially or completely exposed after smoothing.

According to at least one embodiment of the method, a radiation exitsurface of the optics carrier facing away from the carrier is formedafter the direct bonding connection is produced. At the time ofproducing the direct bonding connection, the optics carrier can beformed in particular as a flat optics carrier, which itself does nothave any beam shaping properties. The optical elements are thus onlyformed after the optics carrier is attached to the semiconductor layersequence. In this case, a high-precision arrangement of the opticscarrier relative to the carrier before the direct bonding connection isproduced can be dispensed with.

According to at least one embodiment of the method, the optics carrierhas a plurality of optical elements before the direct bonding connectionis produced. After the direct bonding connection is produced, no furtherstep is thus required to form the optical elements, apart from severingthe optics carrier during separation.

The method is particularly suitable for the production of aradiation-emitting semiconductor device described above. Therefore, thefeatures mentioned in connection with the radiation-emittingsemiconductor device can also be used for the method and vice versa.

Further embodiments and expediencies result from the followingdescription of the exemplary embodiments in connection with the Figures.

They show:

FIG. 1, FIG. 2, FIG. 3 and FIG. 4 each show an exemplary embodiment of aradiation-emitting semiconductor device using a schematic sectionalview; and

FIGS. 5A, 5B, 5C and 5D and FIGS. 6A and 6B each show an exemplaryembodiment of a method for producing radiation-emitting semiconductordevices on the basis of intermediate steps each represented in schematicsectional view.

Identical, similar or similar-acting elements are marked with the samereference signs in the Figures.

The Figures are all schematic representations and therefore notnecessarily true to scale. Rather, comparatively small elements and inparticular layer thicknesses can be shown in exaggerated size forclarification.

FIG. 1 shows an exemplary embodiment of a radiation-emittingsemiconductor device. The radiation-emitting semiconductor device 1 hasa semiconductor body 2 with an active region 20 provided for generatingradiation. The semiconductor body 2 is arranged on a carrier 3. Forexample, the carrier is a growth substrate for the epitaxial depositionof the semiconductor layers of the semiconductor body. The carrier canalso be different from the growth substrate. In this case, the carriercan be attached to the semiconductor body 2 by means of a bonding layer.

The semiconductor device 1 further has an optical element 4. The opticalelement 4 is attached to the semiconductor body 2 by a direct bondingconnection 6. The direct bonding connection is exemplarily formedbetween an auxiliary bonding layer 61 and a further auxiliary bondinglayer 62. For example, the auxiliary bonding layer 61 and the furtherauxiliary bonding layer 62 each contain an oxide, such as a siliconoxide. In contrast thereto, the semiconductor device 1 can, however,also have only one auxiliary bonding layer or no auxiliary bondinglayer.

The optical element 4 is formed transmissive for the radiation to begenerated in the active region 20. For example, the optical element 4has a glass, gallium phosphide, gallium nitride or silicon. Silicon isparticularly suitable for radiation in the infrared spectral range witha wavelength of at least 1100 nm.

The optical element 4 is exemplarily formed as a refractive optics,which for example collimates or focuses the radiation to be generated.In plan view of the semiconductor device, the optical element has, forexample, a convexly curved radiation exit surface 40. However, theoptical element can also be formed, for example, for a beam widening or,in general, for a beam shaping according to a predetermined radiationcharacteristic.

Furthermore the optical element 4 can also be formed as a diffractiveoptical element. In the case of a diffractive optical element, the modeof operation is not based on refraction, but rather on diffraction ofthe radiation impinging on the optical element.

The optical element 4 and the carrier 3 form in places a part of theside surface 11, which delimits the semiconductor device 1 in thelateral direction. A side surface 45 of the optical element and a sidesurface 30 of the carrier terminate flush with one another on the sidesurface 11 of the semiconductor device 1.

For the external electrical contacting, the semiconductor device 1 hastwo contacts, wherein one of the contacts is arranged on the side of thesemiconductor body 2 facing the optical element 4. The optical element 4has a breakthrough 41 in which the contact 5 is exposed for theelectrical contacting, for example, by means of a bonding wire. Thebreakthrough 41 also extends through the auxiliary bonding layers 61,62, if present.

The semiconductor device 1, for example, is formed as a surface-emittinglaser or as a light-emitting diode with resonant cavity. The activeregion 20 is arranged between a mirror region 7 and further mirrorregion 75.

In the exemplary embodiment shown, both mirror region 7 and the furthermirror region 75 are part of the semiconductor body. The electricalcontacting of the active region 20 is carried out through the mirrorregion 7 and the further mirror region 75.

The semiconductor body 2 comprises a first semiconductor region 21 and asecond semiconductor region 22, wherein the first semiconductor regionand the second semiconductor region are different from one another withrespect of the charge type, and the active region is arranged betweenthe first semiconductor region 21 and the second semiconductor region22. The active region 20 is thus located in a pn-junction. The mirrorregion 7 is a part of the second semiconductor region 22, and thefurther mirror region 75 is a part of the first semiconductor region 21.

For example, the active region is provided for generation radiation inthe ultraviolet, visible or infrared spectral range.

The semiconductor body 2, in particular the active region 20, preferablycontains III-V compound semiconductor material.

III-V compound semiconductor materials are particularly suitable forgenerating radiation in the ultraviolet (Al_(x)In_(y)Ga_(1-x-y) N) overthe visible (Al_(x) In_(y) Ga_(1-x-y) N, in particular for blue to greenradiation, or Al_(x)In_(y)Ga_(1-x-y) P, in particular for yellow to redradiation) to the infrared (Al_(x)In_(y)Ga_(1-x-y) As) spectral range.Here, 0≤x≤1, 0≤y≤1 and x+y≤1 apply in each case, in particular with x≠1,y≠1, x≠0 and/or y≠0. With III-V compound semiconductor materials, inparticular from the material systems mentioned, high internal quantumefficiencies can further be achieved during radiation generation.

The exemplary embodiment shown in FIG. 2 substantially corresponds tothe exemplary embodiment described in connection with FIG. 1. Incontrast, the semiconductor device 1 has a plurality of segments 20A,20B of the active region. The segments can be arranged next to oneanother in lateral direction, i.e. along a main plane of extension ofthe active region, in a rows-like or in a matrix-like manner.

The optical element 4 extends continuously over the segments 20A, 20B.The segments are each assigned to an optical segment 42, wherein theoptical segments 42 are each formed in the same way with respect totheir beam shaping properties. However, the optical segments 42 candiffer from one another in terms of beam shaping. The segments 20A, 20Bcan each be externally electrically contacted independently of oneanother via assigned contacts 5. A contact 5 arranged on the side of thecarrier 3 facing away from the semiconductor body 2 can form a commonback contact for two or more, in particular all segments.

Such a segmentation of the active region can also be used for theexemplary embodiment described below.

The exemplary embodiment shown in FIG. 3 substantially corresponds tothe exemplary embodiment described in connection with FIG. 1. Incontrast, the mirror region 7 is arranged between the direct bondingconnection 6 and the optical element 4. During the production of thesemiconductor device, the mirror region 7 can thus be formed separatelyfrom the semiconductor body 2 on the optical element 4. For example, themirror region 7 is formed by a Bragg mirror in the form of severaldielectric layers, wherein adjacent layers differ from one another interms of their refractive indices.

The layer of the mirror region 7 closest to the semiconductor body 2also forms the interface for the production of the direct bondingconnection 6. In contrast, as described in connection with FIG. 1, afurther auxiliary bonding layer can also be provided.

The exemplary embodiment shown in FIG. 4 substantially corresponds tothe exemplary embodiment described in connection with FIG. 1.

In contrast thereto, the semiconductor device 1 has two contacts 5 forexternal electrical contacting on the side of the semiconductor body 2facing away from the optical element 4, in particular on the side of thecarrier 3 facing away from the optical element. On the side facing theoptical element 4, the semiconductor body 2 is completely free ofelements for external electrical contacting. The optical element 4 cancompletely cover the semiconductor body 2 without affecting the externalelectrical contacting of the semiconductor device 1. The secondsemiconductor region 22, which is arranged on the side of active region20 facing away from carrier 3, is electrically contacted via a recess 25in the semiconductor body. The recess 25 extends in particular throughthe active region 20. To avoid an electrical short of the active region20, the recess is lined with an insulating layer 26.

FIGS. 5A to 5D show an exemplary embodiment of a method for producingsemiconductor devices, wherein only one semiconductor device is producedexemplarily as described in connection with FIG. 1.

As shown in FIG. 5A, a semiconductor layer sequence 29 with an activeregion 20 provided for generating radiation is provided on a carrier 3.The semiconductor layer sequence 2 can already be structured into aplurality of semiconductor bodies in lateral direction. This is notshown for simplification.

A contact 5 is arranged on the side of the semiconductor layer sequence29 facing away from carrier 3. An auxiliary bonding layer 61 completelycovers the contact 5 and fills the interspaces 51 between the contacts5. In the interspaces 51 the auxiliary bonding layer adjoins thesemiconductor layer sequence 29. The auxiliary bonding layer 61 forms afirst interface 81. Subsequently, the first interface 81 is levelled ifnecessary, as shown in FIG. 5B, for example by chemo-mechanicalpolishing.

An optics carrier 49 is provided, wherein the optics carrier in theexemplary embodiment shown has a plurality of optical elements 4 (FIG.5B). The optical elements 4 are formed continuously in the opticscarrier 49. The optics carrier 49 completely covers the semiconductorlayer sequence 29. A second interface 82 of the optics carrier 49 isexemplarily formed by means of a further auxiliary bonding layer 62.

A high-precision relative adjustment between the optics carrier 49 andthe carrier 3 with the semiconductor layer sequence 29 can be achieved,for example, by means of alignment marks, which can be arranged at theedge of the optics carrier 49 and/or the carrier 3 with thesemiconductor layer sequence 29. These are arranged outside thesemiconductor devices to be produced and are therefore not explicitlyshown in the Figures. Thus, accuracies of 1 μm or less of the relativeadjustment between optics carrier and semiconductor layer sequence inlateral direction can be achieved.

Subsequently, a direct bonding connection 6 is produced between thefirst interface 81 and the second interface 82, as shown in FIG. 5C.

The contacts 5 are exposed. For this purpose, a plurality ofbreakthroughs 41 are formed in the optics carrier 49, for example byetching.

Finally, a separation into a plurality of semiconductor devices 1 isperformed along separation lines 9 (FIG. 5D). During separation, theoptics carrier 49 and the carrier 3 with the semiconductor layersequence 29 are severed in such a way that the finished semiconductordevices each have a part of the carrier 3, a semiconductor body 2 formedfrom the semiconductor layer sequence 29 and an optical element 4. Afterseparation, it is therefore no longer necessary to apply an opticalelement to each individual semiconductor device.

Separation can be carried out mechanically, for example by sawing,chemically, for example by etching, or by means of coherent radiation,for example by a laser separation process.

FIGS. 6A and 6B show another exemplary embodiment of a method. Thisexemplary embodiment substantially corresponds to the exemplaryembodiment described in connection with FIGS. 5A to 5D.

In contrast thereto, the optics carrier 49 is attached to the carrier 3with the semiconductor layer sequence 29 in a completely unstructuredlateral direction by means of a direct bonding connection 6 (FIG. 6A).Only subsequently, the optics carrier 49 is processed at a radiationexit surface 40 facing away from the semiconductor layer sequence 29 inorder to form the optical elements 4 (FIG. 6B). This can be carried outby an etching process, for example. In this case, a high-precisionadjustment of the optics carrier 49 relative to the carrier 3 with thesemiconductor layer sequence 29 can be dispensed with.

The further steps, such as the separation, can be carried out asdescribed in connection with FIGS. 5A to 5D.

This patent application claims the priority of the German patentapplication 102017122325.8, the disclosure content of which is herebyincorporated by reference.

The invention is not limited by the description based on the exemplaryembodiments. Rather, the invention comprises any new feature as well asany combination of features, which in particular includes anycombination of features in the claims, even if this feature orcombination itself is not explicitly stated in the claims or theexemplary embodiments.

The invention claimed is:
 1. A radiation-emitting semiconductor devicecomprising a semiconductor body having an active region provided forgenerating radiation; a carrier on which the semiconductor body isarranged; and an optical element, wherein the optical element isattached to the semiconductor body with a direct bonding connection,wherein a mirror region is arranged between the active region and theoptical element, and wherein the mirror region is arranged between thedirect bonding connection and the optical element.
 2. Theradiation-emitting semiconductor device according to claim 1, whereinthe carrier and the optical element terminate flush with a side surfacedelimiting the semiconductor device.
 3. The radiation-emittingsemiconductor device according to claim 1, wherein the active region isdivided into a plurality of segments and the optical element extendscontinuously over the plurality of segments.
 4. The radiation-emittingsemiconductor device according to claim 1, wherein a contact forexternal electrical contacting of the semiconductor device is arrangedon a side of the semiconductor body facing the optical element; thedirect bonding connection is adjacent to an auxiliary bonding layer on aside facing the semiconductor body; and the auxiliary bonding layercompletely covers the contact and in places has a greater verticalextent than the contact.
 5. The radiation-emitting semiconductor deviceaccording to claim 1, wherein the radiation-emitting semiconductordevice has two contacts for external electrical contacting on a side ofthe carrier facing away from the optical element.
 6. A method forproducing a plurality of radiation-emitting semiconductor devices,comprising the steps of: a) providing a semiconductor layer sequencehaving an active region provided for generating radiation on a carrierand having a first interface, wherein a contact is arranged on thesemiconductor layer sequence; b) providing an optics carrier having asecond interface; c) producing a direct bonding connection between thefirst interface and the second interface; and d) separating into theplurality of radiation-emitting semiconductor devices, wherein theradiation-emitting semiconductor devices each comprise a part of thecarrier, the semiconductor layer sequence and the optics carrier,wherein the contact is covered by the optics carrier in step c) and isexposed after step c).
 7. The method according to claim 6, wherein instep d) the optics carrier and the carrier are severed.
 8. The methodaccording to claim 6, wherein prior to step c), the first interfaceand/or the second interface are chemomechanically polished.
 9. Themethod according to claim 6, wherein the contact and an auxiliarybonding layer, which cover the contact, are arranged on thesemiconductor layer sequence and the auxiliary bonding layer ischemomechanically polished prior to step c).
 10. The method according toclaim 6, wherein a radiation exit surface of the optics carrier facingaway from the carrier is formed after step c).
 11. The method accordingto claim 6, wherein the optics carrier comprises a plurality of opticalelements prior to step c).
 12. The method according to claim 6, whereina radiation-emitting semiconductor device is produced comprising asemiconductor body having an active region provided for generatingradiation, a carrier on which the semiconductor body is arranged, and anoptical element, wherein the optical element is attached to thesemiconductor body with a direct bonding connection.
 13. Aradiation-emitting semiconductor device comprising a semiconductor bodyhaving an active region provided for generating radiation; a carrier onwhich the semiconductor body is arranged; and an optical element,wherein the optical element is attached to the semiconductor body with adirect bonding connection, the optical element has a breakthrough, andthe breakthrough exposes a contact for an electrical contacting of thesemiconductor body.